Semiconductor device including wiring and manufacturing method thereof
AssigneeCasio Computer Co., Ltd.
InventorHiroyasu Jobetto
Life of this patent
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Abstract
A semiconductor construct is provided which has a semiconductor substrate, an external connection electrode, and an electrode enveloping layer for enveloping the external connection electrode. Also, a base plate is provided which includes a wiring having a first opening corresponding to the external connection electrode. Subsequently, the base plate is removed after the semiconductor construct is fixed to the base plate, and a second opening which reaches the external connection electrode is formed on the electrode enveloping layer corresponding to the first opening of the wiring. Then, a connection conductor for electrically connecting the wiring and the external connection electrode is formed.
Claims11
A semiconductor device, comprising:
- a semiconductor construct having a semiconductor substrate, an external connection electrode formed on the semiconductor substrate and an electrode enveloping layer which has a second opening that exposes at least a portion of the external connection electrode;
- an insulating layer formed around a periphery of the semiconductor construct;
- a wiring which is formed below the semiconductor construct and below the insulating layer and including a connection pad having a first opening which is formed at the position corresponding to the external connection electrode;
- and
- a connection conductor for electrically connecting the external connection electrode to the wiring via the second opening and the first opening.
Dependencies are inferred from the claim text.