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US 7,843,058 B2Granted
Flip chip packages with spacers separating heat sinks and substrates
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPei-Haw Tsao, Liang-Chen Lin, Pao-Kang Niu
Life of this patent
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Abstract
A package structure includes a substrate; a die over and flip bonded on the substrate; a heat sink over the die; and one or more spacer separating the heat sink from the substrate.
Claims15
A package structure comprising:
- a substrate;
- a die over and flip bonded on the substrate;
- a stiffener ring encircling the die;
- a heat sink over the die;
- a spacer separating the heat sink from the substrate;
- and
- a plurality of additional spacers, wherein the spacer and the plurality of additional spacers are substantially evenly distributed around the die.
4 more elements
A package structure comprising:
- a package substrate having a first side and a second side;
- a die having a front side and a back side, wherein the front side of the die is flip bonded onto the first side of the package substrate;
- a heat sink mounted on the back side of the die;
- a plurality of spacers spaced apart from each other, each having a first end contacting the heat sink, and a second end contacting the first side of the package substrate;
- a stiffener ring around the die, wherein the stiffener ring is between the die and the plurality of spacers;
- a printed circuit board (PCB), wherein the second side of the package substrate is mounted on the PCB;
- and
- a fixture securing the heat sink on the PCB.
5 more elements
A package structure comprising:
- a package substrate having a first side and a second side;
- a die having a front side and a back side, wherein the front side of the die is flip bonded onto the first side of the package substrate;
- a heat sink mounted on the back side of the die;
- a thermal interface material (TIM) between and adjoining the die and the heat sink;
- and
- a plurality of spacers around the die and spaced apart from each other, each having a first end contacting the first side of the package substrate, and a second end contacting the heat sink, wherein each edge of the die is adjacent to at least one of the plurality of spacers, and wherein one of the first end and the second end of each of the plurality of spacers is fixed onto a respective one of the package substrate and the heat sink, and a remaining one of the first end and the second end of each of the plurality of spacers is in physical contact and not fixed onto a respective one of the package substrate and the heat sink.
3 more elements
A package structure comprising:
- a substrate;
- a die over and flip bonded on the substrate;
- a heat sink over the die;
- and
- a spacer separating the heat sink from the substrate, wherein the spacer forms a ring around the die, wherein the spacer comprises a first end and a second end, each in physical contact with one of the heat sink and the substrate, and wherein the ring comprises a first plurality of horizontal portions and a second plurality of horizontal portions allocated in an alternating pattern, with the first and the second plurality of horizontal portions having different heights.
2 more elements
Dependencies are inferred from the claim text.