Method of making a fiber reinforced printed circuit board panel and a fiber reinforced panel made according to the method
AssigneeIntel Corporation
InventorsWilliam O. Alger, Gary B. Long, Gary A. Brist, Bryce D. Horine
Life of this patent
Estimating the term…
Abstract
A method of making a printed circuit board panel, a printed circuit board panel made according to the method, and a system incorporating a printed circuit board provided onto the panel. The printed circuit board panel has a panel top edge, a panel bottom edge parallel to the panel top edge, and two parallel panel side edges, and further includes a first set of fiber bundles extending at the predetermined angle with respect to the panel side edges, and a second set of fiber bundles extending at the predetermined angle with respect to the panel top edge.
Claims5
A printed circuit board panel comprising a fiber reinforced material, the panel having a panel top edge, a panel bottom edge parallel to the panel top edge, and two parallel panel side edges, the panel further having a first set of fiber bundles extending at a predetermined angle α with respect to the side edges, and a second set of fiber bundles extending at the predetermined angle α with respect to the panel top edge, wherein the angle α is above 0 degrees and below about 22.5 degrees.
Dependencies are inferred from the claim text.