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US 7,843,055 B2Granted
Semiconductor device having an adhesion promoting layer and method for producing it
AssigneeInfineon Technologies AG
InventorsMichael Bauer, Markus Brunnbauer, Edward Fuergut, Joachim Mahler
Life of this patent
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Abstract
A semiconductor device and a method for producing it is disclosed. In one embodiment, an adhesion-promoting layer having nanoparticles is arranged between a circuit carrier and a plastic housing composition for the purpose of enhanced adhesion.
Claims20
A semiconductor device comprising:
- at least one semiconductor chip arranged on a circuit substrate, surface regions of the semiconductor chip and of the circuit substrate forming interface locations for further components of the semiconductor device;
- and
- at least one of the interface locations having an adhesion-promoting layer disposed thereon, where the adhesion-promoting layer has a polymer containing embedded mineral-ceramic nanoparticles:
- and
- a plastic molding material encasing the at least one semiconductor chip and at least a portion of the circuit substrate, wherein a portion of the nanoparticles project from a surface of the adhesion promoting layer and act as anchors to which the plastic molding material bonds so as to be held in place thereby.
2 more elements
A semiconductor device comprising:
- a circuit substrate;
- at least one semiconductor chip arranged on the circuit substrate, where surface regions of the semiconductor chip and of the circuit substrate, other than surface regions between the semiconductor chip and the circuit substrate, form interfaces locations for further circuit components;
- and
- layer means for promoting adhesion disposed on the interfaces locations, the adhesion promoting layer means comprising a material containing a nanoparticles:
- and
- a plastic molding material encasing the semiconductor chip and at least a portion of the circuit substrate. wherein a portion of the nanoparticles project from a surface of the adhesion promoting layer and act as anchors to which the plastic molding material bonds so as to be held in place thereby.
3 more elements
A semiconductor device comprising:
- a circuit substrate:
- at least one semiconductor chip arranged on a circuit substrate:
- and
- an adhesion promoting layer disposed on portions of surface regions of the semiconductor chip and of the circuit substrate, said portions being outside of regions between the semiconductor chip and the circuit substrate, the adhesion promoting layer comprising a material containing nanoparticles;
- and
- a plastic molding material encasing the semiconductor chip and at least a portion of the circuit substrate, wherein a portion of the nanoparticles project from a surface of the adhesion promoting layer and act as anchors to which the plastic molding material bonds so as to be held in place thereby.
3 more elements
Dependencies are inferred from the claim text.