US 7,843,050 B2 · Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Abstract

Microelectronic die packages, stacked systems of die packages, and methods of manufacturing them are disclosed herein. In one embodiment, a system of stacked packages includes a first die package having a bottom side, a first dielectric casing, and first metal leads; a second die package having a top side attached to the bottom side of the first package, a dielectric casing with a lateral side, and second metal leads aligned with and projecting towards the first metal leads and including an exterior surface and an interior surface region that generally faces the lateral side; and metal solder connectors coupling individual first leads to individual second leads. In a further embodiment, the individual second leads have an “L” shape and physically contact corresponding individual first leads. In another embodiment, the individual second leads have a “C” shape and include a tiered portion that projects towards the lateral side of the second casing.

Claims18

Dependent claims

A stacked system of microelectronic die packages, comprising:

a first die package having a bottom side and including a first microelectronic die, a first dielectric casing at least partially covering the first die and defining at least a portion of the bottom side, and individual first metal leads coupled to the first die and having a first exterior surface;
a second die package having a top side attached directly to the bottom side of the first package with an adhesive layer, the second die package including a second microelectronic die, a second dielectric casing at least partially covering the second die and defining at least a portion of the top side and a lateral side, and individual second metal leads coupled to the second die and having a second exterior surface and an interior surface region that generally faces the lateral side, wherein the individual second leads are at least generally aligned with the individual first leads and project, at least in part, towards the first package;
and
external inter-package connectors coupling a first portion of individual first exterior surfaces with a second portion of individual second exterior surfaces.

1 more element

Dependencies are inferred from the claim text.

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Life of this patent

Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods

Life of this patent

Abstract

Claims18