Multi-chip discrete devices in semiconductor packages
AssigneeFairchild Semiconductor Corporation
InventorsManolito Galera, Leocadio Morona Alabin
Life of this patent
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Abstract
Semiconductor packages that contain multiple dies containing discrete devices and methods for making such devices are described. The semiconductor package contains both a first die containing transistor and second die containing a diode. The interconnect lead of the semiconductor package is connected to the bond pad of the transistor. At the same time, the interconnect lead contains a die attach pad for the diode. The result of this configuration is an integrated functional semiconductor device with a diminished footprint and decreased cost of manufacture. By using more than a single die containing a discrete device in a single semiconductor package, the device can also provide a wider variety of functions. Other embodiments are also described.
Claims25
A semiconductor package, comprising:
- a first die containing a first discrete device with a first bond pad on a first surface, the second surface of the first die connected to a first die attach pad;
- a first lead of a leadframe, the first lead having a first end proximate the first die and a second end distal from the first die with a bottom surface of the first end connected to the first bond pad, and the upper surface of the first end of the first lead forming a second die attach pad;
- a second die containing a second discrete device connected to the second die attach pad;
- a connector attached to the second discrete device that mechanically clips that second die to the first die attach pad;
- and
- a molding material encapsulating the connector, the first and second dies, and the first end of the first lead without encapsulating the second end of the first lead.
A semiconductor package, comprising:
- a first die comprising a transistor containing a first bond pad on a first surface, the second surface of the first die connected to a first die attach pad of a die paddle;
- a first lead of a lead frame with an inner part proximate the first die and an outer part distal from the first die, the inner part with a bottom surface connected to the first bond pad, the upper surface of the inner part of the first lead forming a second die attach pad;
- a second die comprising a diode connected to the second die attach pad;
- a connector attached to the diode;
- and
- a molding material encapsulating the inner part of the first lead without encapsulating the outer part of the first lead.
A method for making a semiconductor package, comprising:
- providing a first die comprising a first discrete device containing a first bond pad on a first surface;
- connecting the second surface of the first die to a first die attach pad;
- connecting a bottom surface of a first end of a first lead of a leadframe to the first bond pad, wherein the upper surface of the first end of the first lead comprises a second die attach pad and wherein the first end is proximate the first die and the first lead also contains a second end distal from the first die;
- connecting a second die containing a second discrete device to the second die attach pad;
- attaching a connector to the second discrete device so that the connector mechanically clips the second die to the first die attach pad;
- encapsulating a molding material around the connector, the first and second dies, and the first end of the first lead without encapsulating the second end of the first lead.
A method for making a semiconductor package, comprising:
- providing a first die comprising a transistor containing a first bond pad on a first surface;
- connecting the second surface of the die to a first die attach pad of a die paddle;
- connecting a first lead of a lead frame to the first bond pad, wherein the first lead contains an inner part proximate the first die and an outer part distal from the first die, the inner part with a bottom surface connected to the first bond pad and the upper surface of the inner part of the first lead forming a second die attach pad;
- connecting a second die comprising a diode to the second die attach pad;
- attaching a connector to the diode;
- and
- encapsulating a molding material to enclose the inner part of the first lead without encapsulating the bottom surface or the upper surface of the outer part of the first lead.
Dependencies are inferred from the claim text.