Back to results
US 7,843,047 B2Granted
Encapsulant interposer system with integrated passive devices and manufacturing method therefor
AssigneeSTATS ChipPAC, Ltd.
InventorsHeap Hoe Kuan, Rui Huang, Yaojian Lin, Seng Guan Chow
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a semiconductor package system including: forming a leadframe having a passive device; encapsulating the passive device to form an encapsulant interposer; attaching a first die to the encapsulant interposer; forming a substrate interposer having a second die; and stacking the encapsulant interposer over the substrate interposer.
Claims7
A semiconductor package system comprising:
- an encapsulant interposer having a passive device encapsulated with both the top and the bottom surfaces of the passive device exposed;
- a first die connected to the encapsulant interposer;
- and
- a substrate interposer having a second die, the encapsulant interposer being stacked over the substrate interposer.
1 more element
Dependencies are inferred from the claim text.