Flat leadless packages and stacked leadless package assemblies
AssigneeVertical Circuits, Inc.
InventorsLawrence Douglas Andrews, Jr., Jeffrey Leal, Simon J. S. McElrea
Life of this patent
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Abstract
A flat leadless package includes at least one die mounted onto a leadframe and electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, an assembly includes stacked leadless packages electrically connected to leads using an electrically conductive polymer or an electrically conductive ink. Also, a package module includes an assembly of stacked leadless packages mounted on a support and electrically connected to circuitry in the support using an electrically conductive polymer or an electrically conductive ink.
Claims34
A flat leadless package comprising a leadframe comprising a plurality of leads and a plurality of die in a stack mounted onto the leadframe and electrically connected to at least some of said leads by an interconnect material comprising an electrically conductive polymer or an electrically conductive ink.
An assembly of stacked flat leadless packages having lead ends exposed at least one sidewall thereof, wherein the packages are interconnected using an electrically conductive polymer or an electrically conductive ink.
A package module comprising a flat leadless package having lead ends exposed at least one sidewall thereof, electrically connected to circuitry in an underlying support using an electrically conductive polymer or an electrically conductive ink.
A package module, comprising a plurality of stacked flat leadless packages having lead ends exposed at least one sidewall thereof, interconnected using an electrically conductive polymer or an electrically conductive ink.
Dependencies are inferred from the claim text.