Double-side mountable MEMS package

A MEMS package comprising:

• a mounting substrate on which one or more transducer chips are mounted wherein said mounting substrate has a first opening;
• a top cover overlying, attached to, and separated from said mounting substrate by a spacer;
• a bottom cover underlying and joined to said mounting substrate wherein a gap is formed between said bottom cover and said substrate;
• and
• electrical connections between one or more of:
• said one or more transducer chips and said mounting substrate;
• and
• said one or more of said transducer chips and said top cover.

A MEMS package comprising:

• a mounting substrate on which one or more transducer chips are mounted wherein said mounting substrate has a first opening;
• a top cover overlying, attached to, and separated from said mounting substrate by a spacer;
• a bottom cover underlying and joined to said mounting substrate wherein said bottom cover has a second opening and wherein a gap is formed between said bottom cover and said mounting substrate wherein said gap joins said first opening and said second opening and wherein said first opening is not aligned with said second opening;
• electrical connections between one or more of:
• said one or more transducer chips and said mounting substrate;
• said one or more transducer chips and said top cover;
• and
• said one or more transducer chips and said bottom cover;
• and
• pads on outside surfaces of said top and bottom covers used for further attachment to printed circuit boards.

A method for fabricating a MEMS package comprising:

• providing a mounting substrate having a first opening;
• mounting one or more transducer chips on a top surface of said mounting substrate;
• mounting a spacer on said top surface of said mounting substrate;
• mounting a top cover overlying, attached to, and separated from said mounting substrate by said spacer forming a housing enclosed by said top cover, said spacer, and said mounting substrate and accessed by said first opening;
• and
• providing electrical connections between one or more of:
• said one or more transducer chips and said mounting substrate;
• and
• said one or more transducer chips and said top cover.