Sealing board and method for producing the same
AssigneeCitizen Holdings Co., Ltd.
InventorsTakao Kasai, Haruyuki Hiratsuka
Life of this patent
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Abstract
There is provided a sealing board (30) for sealing a container containing an electronic component, constituted of a base which is made of a material exhibiting a low wettability to a brazing filler metal (31) and on a surface of which a metal layer exhibiting a high wettability to the brazing filler metal (31) is formed, a brazing filler metal portion formed on the metal layer to form a closed region, and an exposed portion in which a surface of the base is exposed in at least a part of the closed region. By making at least a part of the sealing board as the exposed portion, it is possible to produce the sealing board with the brazing filler metal for a package stable in quality and inexpensively.
Claims6
A method of producing a sealing board for sealing a container containing an electronic component, comprising the steps of:
- (1) forming a metal layer, exhibiting a high wettability to a brazing filler metal, on an entire surface of a base made of a material exhibiting a low wettability to the brazing filler metal;
- (2) bonding the brazing filler metal onto the metal layer so as to form a closed region, and a brazing filler metal fusion-bonded region where the brazing filler metal is fusion-bonded to the metal layer;
- and
- (3) exposing the surface of the base by removing at least a part of the metal layer in the closed region on opposite sides of the brazing filler metal fusion-bonded region so as to surround the brazing filler metal fusion-bonded region.
A method of producing a sealing board for sealing a container containing an electronic component, comprising the steps of:
- (1) forming a metal layer, exhibiting a high wettability to a brazing filler metal, on an entire surface of a flat base made of a material exhibiting a low wettability to the brazing filler metal, the flat base forming a plurality of sealing boards;
- (2) bonding the brazing filler metal onto the metal layer of the sealing boards so as to form a closed region;
- (3) exposing a surface of the base by removing at least a part of the metal layer in the closed region surrounding a brazing filler metal fusion-bonding portion upon which the brazing filler metal is fusion-bonded;
- and
- (4) separating the sealing boards on which the brazing filler metal is formed from the base.
A sealing board for sealing a container containing an electronic component, comprising:
- a base;
- a metal layer provided on a surface of the base to form a closed region where the metal layer covers the base, and an exposed region where the metal layer does not cover the entire base;
- and
- a brazing filler metal portion formed of brazing filler metal on the metal layer in the exposed portion by fusion bonding to define a brazing filler metal flow-preventing portion on either side of the brazing filler metal portion between the sides of the brazing filler metal portion and sides of the closed region, wherein
- the base is made of a material exhibiting relatively low wettability to the brazing filler metal,
- the metal layer exhibits relatively high wettability to the brazing filler metal, and
- the base material is exposed in the brazing filler metal flow-preventing portions.
Dependencies are inferred from the claim text.