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US 7,842,887 B2Granted
Multilayer printed circuit board
AssigneeIbiden Co., Ltd.
InventorsHajime Sakamoto, Tadashi Sugiyama, Dongdong Wang, Takashi Kariya
Life of this patent
Estimating the term…
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AssigneeIbiden Co., Ltd.
InventorsHajime Sakamoto, Tadashi Sugiyama, Dongdong Wang, Takashi Kariya
Estimating the term…
A multilayer printed circuit board has an IC chip (20) included in a core substrate (30) in advance and a transition layer (38) provided on a pad (24) of the IC chip (20). Due to this, it is possible to electronically connect the IC chip to the multilayer printed circuit board without using lead members and a sealing resin. Also, by providing the transition layer (38) made of copper on the die pad (24), it is possible to prevent resin residues on the pad (24) and to improve connection characteristics between the pad (24) and a via hole (60) and reliability.
A multilayer printed circuit board comprising:
A multilayer printed circuit board comprising:
Dependencies are inferred from the claim text.
Drawings are temporarily unavailable. Open the PDF at USPTO
From the US filing history. Foreign family members aren’t listed.
Interconnections or connectors in packages: die-attach connectors
Associated with components mounted in printed circuit boards [PCB], e.g. insert-mounted components [IMC]: associated with components encapsulated…
Marks applied to devices
Manufacture or treatment: of insulating or insulated package substrates, or of interposers, or of redistribution layers
Term ended 8 Apr 2023 (estimated)
The present invention relates to a buildup multilayer printed circuit board and particularly relates to a multilayer printed circuit board including electronic components such as an IC chip and a multilayer printed circuit board manufacturing method.
An IC chip is electrically connected to a printed circuit board by a mounting method such as a wire bonding method, a TAB method or a flip-chip method.
In the wire bonding method, an IC chip is die-bonded to a printed circuit board by adhesive or the like, the pads of the printed circuit board are connected to the pads of the IC chip by wires such as metallic wires and then a sealing resin such as a thermosetting resin or a thermoplastic resin is applied to protect the IC chip and the wire.
FIG. 1 is a diagram showing a process for manufacturing a multilayer printed circuit board in the first embodiment according to the present invention;
FIG. 2 is a diagram showing a process for manufacturing the multilayer printed circuit board in the first embodiment;
FIG. 3 is a diagram showing a process for manufacturing the multilayer printed circuit board in the first embodiment;
The embodiments of the present invention will be described hereinafter with reference to the drawings.
First, the constitution of a multilayer printed circuit board according to the first embodiment of the present invention will be described with reference to FIG. 6 showing the cross-sectional view of a multilayer printed circuit board 10.
As shown in FIG. 6, the multilayer printed circuit board 10 consists of a core substrate 30 containing therein an IC chip 20, an interlayer resin insulating layer 50 and an interlayer resin insulating layer 150. Via holes 60 and conductor circuits 58 are formed on the interlayer resin insulating layer 50. Via holes 160 and conductor circuits 158 are formed on the interlayer resin insulating layer 150.