Bumping electronic components using transfer substrates
AssigneeWstp, LLC
InventorJohn Mackay
Life of this patent
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Abstract
A method for forming solder bumps on an electronic component. Providing a transfer substrate having a plurality of solder balls, disposing the transfer substrate on the surface of the electronic component, heating to reflow the solder balls onto the electronic component; and removing the sacrificial substrate. The transfer substrate may comprise a sacrificial film and a metal layer patterned with a mask which is used to form solder balls on the transfer substrate. Or, the transfer substrate may comprise a sheet of material having solder balls embedded at least partially in the sheet. A method of aligning a part being bumped with a transfer substrate, using a shuttle mechanism and an alignment film is disclosed.
Claims5
Method of aligning a transfer substrate to a product being bumped comprising the steps of:
- providing a machine having first a chuck for holding the product being bumped, a second chuck for holding a transfer substrate, and frame for holding an alignment film;
- shuttling the alignment film to the product being bumped, and aligning the product being bumped;
- and
- shuttling the alignment film to the transfer substrate, and aligning the transfer substrate.
Dependencies are inferred from the claim text.