Adhesive composition, adhesive sheet and production process for semiconductor device
AssigneeLintec Corporation
InventorsNaoya Saiki, Isao Ichikawa, Hironori Shizuhata, Osamu Yamazaki
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Abstract
The adhesive composition according to the present invention is characterized by including an acrylic copolymer (A), an epoxy thermosetting resin (B) and a compound (C) having a functional group which can react with an epoxy group and having an unsaturated hydrocarbon group. According to the present invention, the high package reliability can be achieved even when exposed to severe reflow conditions in a package in which a thin semiconductor chip is mounted.
Claims18
An adhesive composition comprising an acrylic copolymer (A), an epoxy thermosetting resin (B) and a compound (C) having a functional group which can react with an epoxy group and having an unsaturated hydrocarbon group.
Dependencies are inferred from the claim text.