Fixture for P-through silicon via assembly
AssigneeTaiwan Semconductor Manufacturing Company, Ltd.
InventorsChien-Hsiun Lee, Chen-Shien Chen, Mirng-Ji Lii, Tjandra Winata Karta
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Abstract
A silicon-based wafer such as a TSV interposer wafer having a first and second surfaces wherein a glass carrier is mounted on the second surface by a UV tape is held by a vacuum holder applied on the first surface and the glass carrier is removed from the silicon-based wafer by irradiating the UV tape with a UV light through the glass carrier. The silicon-based wafer is then flipped and placed onto a vacuum plate and secured to the vacuum plate by applying vacuum to the vacuum plate. The vacuum holder is then released from the silicon-based wafer leaving the silicon-based wafer secured to the vacuum plate for subsequent processing steps.
Claims9
A method of handling a silicon-based wafer having a first and second surfaces wherein a glass carrier is mounted on the second surface of the silicon-based wafer by a UV tape, the method comprising:
- holding the silicon-based wafer by a vacuum holder applied on the first surface of the silicon-based wafer;
- removing said glass carrier from the silicon-based wafer by irradiating said UV tape with a UV beam through the glass carrier, thereby releasing the UV tape;
- flipping the silicon-based wafer;
- placing the silicon-based wafer onto a vacuum plate;
- securing the silicon-based wafer on the vacuum plate by applying vacuum to the vacuum plate;
- and
- releasing the vacuum holder from the silicon-based wafer.
A method of packaging a semiconductor device comprising:
- providing a thin silicon-based wafer having a first and a second surface, said silicon-based wafer mounted to a glass carrier on the second surface by a UV tape;
- holding the silicon-based wafer by a vacuum holder applied on the first surface of the silicon-based wafer;
- removing said glass carrier from the silicon-based wafer by irradiating said UV tape with a UV beam through the glass carrier, thereby releasing the UV tape;
- flipping the silicon-based wafer;
- placing the silicon-based wafer onto a vacuum plate, said vacuum plate contacting the second surface of the silicon-based wafer;
- securing the silicon-based wafer on the vacuum plate by applying vacuum to the vacuum plate;
- releasing the vacuum holder from the silicon-based wafer;
- and
- flip-chip bonding one or more semiconductor devices to the silicon-based wafer on the first surface of the silicon-based wafer.
Dependencies are inferred from the claim text.