Integrated circuit module and method of packaging same

A method of making an integrated circuit (IC) module comprising:

• attaching an outer surface of a ground plane to a process carrier, said ground plane having a first cutout and a second cutout, each of said first and second cutouts extending through said ground plane, said second cutout having a first end and a second end, said first end adjoining said first cutout;
• coupling a first surface of a first device to said process carrier, said first device being positioned in said first cutout;
• fastening a second surface of a second device to said process carrier, said second device being positioned outside of said first cutout and adjacent to said second end of said second cutout;
• encapsulating said ground plane, said first device, and said second device in a packaging material, such that said outer surface, said first surface, and said second surface are exposed out of said packaging material;
• forming conductive vias in said packaging material surrounding at least one of said first cutout and said second cutout, said conductive vias extending between said ground plane and an exterior surface of said packaging material;
• forming a metallization layer overlying at least a portion of said outer surface of said ground plane to include a passage region at which said metallization layer is absent, said passage region being in stacked alignment with said second cutout, wherein together said second cutout and said passage region define a critical signal pathway;
• and
• forming an electrical interconnect positioned in said critical signal pathway to produce said IC module, said electrical interconnect interconnecting said first device with said second device.

A method of making an integrated circuit (IC) module comprising:

• attaching an outer surface of a ground plane to a process carrier, said ground plane having a first cutout and a second cutout, each of said first and second cutouts extending through said ground plane, said second cutout having a first end and a second end, said first end adjoining said first cutout;
• coupling a first surface of a first device to said process carrier, said first device being positioned in said first cutout;
• fastening a second surface of a second device to said process carrier, said second device being positioned outside of said first cutout and adjacent to said second end of said second cutout;
• encapsulating said ground plane, said first device, and said second device in a packaging material, such that said outer surface, said first surface, and said second surface are exposed out of said packaging material;
• forming a first metallization layer on said exterior surface of said packaging material;
• forming a second metallization layer overlying at least a portion of said outer surface of said ground plane such that said ground plane, said first device, and said second device are interposed between said first and second metallization layers, said second metallization layer including a passage region at which said second metallization layer is absent, said passage region being in stacked alignment with said second cutout, wherein together said second cutout and said passage region define a critical signal pathway;
• and
• forming an electrical interconnect positioned in said critical signal pathway to produce said IC module, said electrical interconnect interconnecting said first device with said second device.