Embedded semiconductor die package and method of making the same using metal frame carrier

A method of making an embedded semiconductor die package, comprising:

• providing a temporary carrier;
• depositing an adhesive layer over the temporary carrier;
• mounting a frame carrier to the adhesive layer, the frame carrier including a plurality of die mounting sites each having a lead frame interconnect structure around a cavity;
• disposing a semiconductor die in the cavity;
• depositing an encapsulant in the cavity over the semiconductor die;
• forming a first conductive layer over a first side of the lead frame interconnect structure and the encapsulant, the first conductive layer and the lead frame interconnect structure being electrically connected to the semiconductor die;
• forming a first insulating layer over the first conductive layer;
• and
• singulating the frame carrier.

A method of making an embedded semiconductor die package, comprising:

• providing a temporary carrier;
• mounting a frame carrier to the temporary carrier, the frame carrier including a plurality of die mounting sites each having a lead frame interconnect structure around a cavity;
• disposing a semiconductor die in the cavity;
• depositing an encapsulant in the cavity over the semiconductor die;
• forming a package interconnect structure over the lead frame interconnect structure and the encapsulant, the package interconnect structure and the lead frame interconnect structure being electrically connected to the semiconductor die;
• and
• singulating the frame carrier.

A method of making an embedded semiconductor die package, comprising:

• providing a frame carrier having a wafer-form factor including a plurality of die mounting sites disposed across the wafer-form factor of the frame carrier each having a lead frame interconnect structure around a cavity;
• disposing a semiconductor die in the cavity;
• depositing an encapsulant in the cavity over the semiconductor die;
• forming a package interconnect structure over the encapsulant, the package interconnect structure and the lead frame interconnect structure being electrically connected to the semiconductor die;
• and
• singulating the frame carrier.