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US 7,842,526 B2Granted
Light emitting device and method of producing same
AssigneeToyoda Gosei Co., Ltd.
InventorsKunihiro Hadame, Yoshinobu Suehiro
Life of this patent
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Abstract
A light emitting device having: a light emitting element; an electricity supply portion on which the light emitting element is mounted and which supplies electricity; and an inorganic sealing material for sealing the light emitting element. The inorganic sealing material has a tapered surface which becomes wider outward in a side surface direction with respect to a center axis of the light emitting element.
Claims9
A method of producing a light emitting device, comprising:
- a first step of mounting a plurality of surface mounting type light emitting elements on an insulative substrate at predetermined distances from one another;
- a second step of forming a glass sealing member with uniform thickness, by hot-pressing, such as to cover the plurality of light emitting elements, the glass sealing member comprising a low melting point glass and directly contacting said light emitting elements;
- and
- a third step of cutting the substrate and the glass sealing member such that a tapered surface is formed around each of the plurality of light emitting elements, wherein in the third step, the substrate and the glass sealing member are cut by a tapered blade having a cutting edge angle corresponding to an angle of the tapered surface.
1 more element
A method of producing a light emitting device, the light emitting device comprising:
- a light emitting element;
- a plate-like ceramic substrate on which the light emitting element is mounted;
- and
- a glass sealing member that is bonded to an upper surface of the ceramic substrate for sealing the light emitting element and comprises a tapered surface such that a cross sectional area thereof in a lateral direction increases upward,
- said method comprising:
- a first step of flip-mounting the light emitting element on the ceramic substrate;
- and
- a second step of setting a plate-like low-melting-point glass parallel to the ceramic substrate, parallel-moving the low-melting-point glass to the upper surface of the ceramic substrate, and hot-pressing the low-melting-point glass onto the upper surface of the ceramic substrate, such that the glass sealing member is formed directly contacting the light emitting element to seal the light emitting element and bonded to the upper surface of the ceramic substrate.
5 more elements
Dependencies are inferred from the claim text.