Back to results
US 7,842,519 B2Granted
In-line lithography and etch system
AssigneeTokyo Electron Limited
InventorsMark G. Winkler, Thomas E. Winter
Life of this patent
Estimating the term…
Abstract
The invention can provide a method of processing a wafer using Site-Dependent (S-D) processing sequences that can include S-D creation procedures, S-D evaluation procedures, and S-D transfer sequences. The S-D creation procedures can be performed using S-D processing elements, the S-D evaluation procedures can be performed using S-D evaluation elements, and S-D transfer sequences can be performed using site-dependent transfer subsystems. Site-dependent data can be stored in site-dependent libraries and/or databases.
Claims20
A wafer processing platform comprising:
- a plurality of Site-Dependent (S-D) processing modules, each S-D processing module including a tool for processing at least one Site-Dependent (S-D) wafer based on Site-Dependent (S-D) processing data, wherein the S-D processing data is based on a manufacturing process developed for the S-D wafer;
- a plurality of Non-Site-Dependent (N-S-D) processing modules, each N-S-D processing module including a tool for processing at least one Non-Site-Dependent (N-S-D) wafer based on Non-Site-Dependent (N-S-D) processing data, wherein the N-S-D processing data is based on a manufacturing process developed for the N-S-D wafer;
- at least one robot configured to transport S-D and N-S-D wafers between the S-D and N-S-D modules, the at least one robot moving on rails on a side of the S-D and N-S-D modules;
- at least one inspection module configured to inspect the processes completed on the S-D and N-S-D wafers in the S-D and N-S-D processing modules;
- a common control unit which controls and receives site specific wafer data from each of the S-D processing modules, the at least one robot and the at least one inspection module and adjusts the S-D processing data in the plurality of S-D processing modules based on the received data.
2 more elements
A wafer processing system comprising:
- receiving means for receiving the plurality of wafers by the processing system, the processing system including Site-Dependent (S-D) and Non-Site-Dependent (N-S-D) subsystems, each wafer having wafer data associated therewith, wherein the wafer data includes S-D confidence data and/or N-S-D confidence data;
- first establishing means for establishing a first set of S-D wafers using the S-D confidence data and/or N-S-D confidence data;
- determining means for determining first S-D processing sequences for the first set of S-D wafers, the first set of S-D wafers being processed in first S-D subsystems using the first S-D processing sequences, wherein wafer state data is used to establish the first S-D processing sequences;
- first Site-Dependent (S-D) transferring means for transferring the first set of S-D wafers to one or more first S-D processing elements in the first S-D subsystems, the first S-D processing sequences being used to determine the one or more first S-D processing elements;
- collecting means for collecting first S-D subsystem processing data before, during, and/or after the first S-D processing sequences are performed using the first set of S-D wafers;
- second establishing means for establishing first S-D confidence data for one or more wafers in the first set of S-D wafers using the wafer data and/or the first S-D subsystem processing data;
- third establishing means for establishing additional sets of S-D wafers using the first S-D confidence data, the S-D confidence data, or the N-S-D confidence data, or any combination thereof;
- and
- second Site-Dependent (S-D) transferring means for transferring the additional sets of S-D wafers to one or more additional S-D processing elements in additional subsystems, with additional S-D processing sequences being used to determine the one or more additional S-D processing elements.
6 more elements
A wafer processing system for processing wafers comprising:
- a Site-Dependent (S-D) transfer subsystem configured to receive one or more of the wafers, the processing system including Site-Dependent (S-D) and Non-Site-Dependent (N-S-D) subsystems, each wafer having wafer data associated therewith, wherein the wafer data includes S-D confidence data and/or N-S-D confidence data;
- a first establishing unit configured to establish a first set of S-D wafers using the S-D confidence data and/or N-S-D confidence data;
- a determining unit configured to determine first S-D processing sequences for the first set of S-D wafers, the first set of S-D wafers being processed in first S-D subsystems using the first S-D processing sequences, wherein wafer state data is used to establish the first S-D processing sequences;
- wherein the S-D transfer subsystem is further configured to transfer the first set of S-D wafers to one or more first S-D processing elements in the first S-D subsystems, the first S-D processing sequences being used to determine the one or more first S-D processing elements;
- a collecting unit configured to collect first S-D subsystem processing data before, during, and/or after the first S-D processing sequences are performed using the first set of S-D wafers;
- a second establishing unit configured to establish first S-D confidence data for one or more wafers in the first set of S-D wafers using the wafer data and/or the first S-D subsystem processing data;
- and
- a third establishing unit configured to establish additional sets of S-D wafers using the first S-D confidence data, the S-D confidence data, or the N-S-D confidence data, or any combination thereof;
- wherein the S-D transfer subsystem is further configured to transfer the additional sets of S-D wafers
- to one or more additional S-D processing elements in additional subsystems, with additional S-D processing sequences being used to determine the one or more additional S-D processing elements.
7 more elements
Dependencies are inferred from the claim text.