High-resolution, patterned-media master mask
AssigneeHitachi Global Storage Technologies Netherlands B.V.
InventorsJames G. Belleson, Michael A. Parker, Robert O. Schwenker
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AssigneeHitachi Global Storage Technologies Netherlands B.V.
InventorsJames G. Belleson, Michael A. Parker, Robert O. Schwenker
Estimating the term…
A high-resolution, patterned-media master mask is disclosed. The high-resolution, patterned-media master mask includes an electron-absorption substrate for absorbing electrons from an electron beam (e-beam) during an e-beam exposure by an e-beam lithography process and suppressing a backscattering of the electrons based on an electron-backscattering-suppressing atomic number associated with a constituent atomic species of the electron-absorption substrate, wherein the electron-absorption substrate comprises a material composed of greater than fifty atomic percent of the constituent atomic species, and wherein the electron backscattering-suppressing atomic number is less than an atomic number eight. The high-resolution, patterned-media master mask further includes a patterned portion coupled with the electron-absorption substrate, wherein the patterned portion is patterned by the e-beam lithography process, and wherein a resolution of the patterned portion is increased in response to the electron-absorption substrate suppressing the backscattering of the electrons.
A high-resolution, patterned-media master mask comprising:
A system for generating a high-resolution, patterned-media master mask, said system comprising:
A method of increasing a resolution of a physical pattern in a patterned-media master mask, said method comprising:
Dependencies are inferred from the claim text.
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For changing properties of the objects or for applying thin layers thereon, e.g. for ion implantation: particle-beam lithography, e.g. electron…
Nanotechnology for information processing, storage or transmission
Manufacture or treatment of nanostructures
Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g.…
About 2 years 7 months of term left · ends 27 May 2029 (estimated)
Embodiments of the present technology relate to the field of electron beam (e-beam) lithography.
Over the years, computer systems have become increasingly important in human society. Word processing, database management and communication applications are just a few of the tools that modern computers offer. However, as the utilization of computer systems continues to increase, so does the need to store vast quantities of digital information. In view of this need, various data storage systems, such as hard-disk drives (HDDs), have been developed. In general, HDDs offer a low-cost and reliable means of storing computing information.
One of the fields of magnetic data storage involves the use of patterned-media. In one embodiment, data is recorded in uniform arrays of isolated magnetic islands, called magnetic grains, along the surface of a patterned layer, wherein a logical bit is stored in a single magnetic grain. However, since the achievable storage capacity of patterned media is dependent on the resolution of lithographic processing techniques used to fabricate these grains, a need exists for increasing the achievable resolution of fabricated grain patterns used in these media.
The accompanying drawings, which are incorporated in and form a part of this specification, illustrate various embodiments of the technology and, together with the description, serve to explain exemplary principles of the technology. Moreover, the drawings are used to illustrate principles of the illustrated embodiments, and are not intended to narrow the scope of these embodiments to the details illustrated therein.
FIG. 1 is a diagram of an example HDD in accordance with an embodiment of the present technology.
FIG. 2 is a plan view of an example exposure distribution in accordance with an embodiment of the present technology.
Components described in the illustrated embodiments have not been drawn to scale. Therefore, neither the illustrated embodiments, nor the components illustrated therein, shall be limited to the size or scale of the illustrated objects.
Reference will now be made in detail to a number of embodiments of the present technology, examples of which are illustrated in the accompanying drawings. While the technology will be described in conjunction with various embodiments, these embodiments are not intended to limit spirit or scope of the present technology. On the contrary, the presented technology is intended to cover alternatives, modifications and equivalents, which may be included within the spirit and scope of the various embodiments as defined by the appended claims.
Furthermore, in the following detailed description of a number of aspects of the present technology, numerous specific details are set forth in order to provide a thorough understanding of the present technology. However, the present technology may be practiced without these specific details. In other instances, well known methods, procedures, and components have not been described in detail as not to unnecessarily obscure aspects of the present technology.