US 7,842,397 B2 · Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil

Abstract

A nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no nickel chloride; and adjusting a pH of the resultant solution to 2 or more and less than 4. Another nickel plating solution preparation method has the steps of: dissolving in water 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid, but adding no boric acid; and adjusting a pH of the resultant solution to 2 or more and less than 4.

Claims3

Dependent claims

A printed wiring board copper foil, comprising:

a nickel plating layer comprising a nickel-cobalt alloy plating layer, a total deposit amount of nickel and cobalt on a side to be bonded to a printed wiring board base material being 5 μg/cm2 or more to 20 μg/cm2 or less, a cobalt concentration being 60 mass % or more to 80 mass % or less,
wherein said nickel plating layer is applied to said copper foil by using an insoluble anode and a nickel plating solution comprising water, 100 g/L or more and less than 200 g/L of nickel sulfate, and 10 g/L or more and less than 30 g/L of sodium citrate or 8 g/L or more and less than 25 g/L of citric acid dissolved in the water, but no nickel chloride and boric acid added therein, wherein a pH of the solution is adjusted to 2 or more and less than 4.

Dependencies are inferred from the claim text.

Facts

Application

11/524,781Filed 21 Sep 2006

Priority

JP 2005-28082627 Sep 2005

Published

US 2007/0071999 A129 Mar 2007

Granted

30 Nov 2010

Term ends

Not estimatedThe source records don’t support an estimate.

Classification18 codes

C25D 3/12
From solutions: of nickel or cobalt
C25D 3/562
Of alloys: containing more than 50% by weight of iron or nickel or cobalt
H05K 3/384
By special treatment of the metal: by plating
H05K 3/389
Improvement of the adhesion between the insulating substrate and the metal: by the use of a coupling agent, e.g. silane

Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil

Life of this patent

Nickel plating solution and its preparation method, nickel plating method and printed wiring board copper foil

Life of this patent

Abstract

Claims3