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US 7,842,381 B2Granted
Thermally conductive EMI shield
AssigneeLaird Technologies, Inc.
InventorRichard Norman Johnson
Life of this patent
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AssigneeLaird Technologies, Inc.
InventorRichard Norman Johnson
Estimating the term…
Electromagnetic-energy absorbing materials are combined with thermally conductive materials, such as those used for thermal management in association with electronic equipment, thereby suppressing the transmission of electromagnetic interference (EMI) therethrough. Disclosed are materials and processes for combining EMI-absorbing materials with thermally conductive materials thereby improving EMI shielding effectiveness in an economically efficient manner. In one embodiment, a thermally conductive EMI absorber is prepared by combining an EMI-absorbing material (for example, ferrite particles) with a thermally conducting material (for example, ceramic particles), each suspended within an elastomeric matrix (for example, silicone). In application, a layer of thermally conductive EMI-absorbing material is applied between an electronic device or component, and a heat sink.
A thermally conductive composite material for reducing electromagnetic emissions generated by an electronic device, the thermally conductive composite material comprising a thermally conductive material in particulate form, an electromagnetic-energy-absorptive material including iron silicide in particulate form, and a polymeric base material, the thermally conductive material and the electromagnetic-energy-absorptive material being suspended within the polymeric base material, the polymeric base material being substantially transparent to electromagnetic energy, wherein the thermally conductive composite material is configured such that when placed between an electronic device and a proximate structure, the thermally conductive material is operable for facilitating transfer of thermal energy from the electronic device and the electromagnetic-energy-absorptive material is operable for reducing electromagnetic emissions generated by the electronic device.
A method of reducing electromagnetic emissions produced by a device, the method comprising:
A thermally conductive composite material for reducing electromagnetic emissions generated by an electronic device, the thermally conductive composite material comprising a thermally conductive material in particulate form, an electromagnetic-energy-absorptive material including iron silicide in particulate form, and a polymeric base material, the thermally conductive material and the electromagnetic-energy-absorptive material being suspended within the polymeric base material, the polymeric base material being substantially transparent to electromagnetic energy, and comprising a phase-change material including a mixture of a paraffin wax and an ethylene-vinyl acetate copolymer, which is configured to exist in a solid phase at ambient room temperature and transition to a liquid phase at a reflow temperature, to conform to a surface of a device, wherein the thermally conductive composite material is configured such that when placed between an electronic device and a proximate structure, the thermally conductive material is operable for facilitating transfer of thermal energy from the electronic device and the electromagnetic-energy-absorptive material is operable for reducing electromagnetic emissions generated by the electronic device.
A thermally conductive composite material for reducing electromagnetic emissions generated by an electronic device, the thermally conductive composite material comprising:
Dependencies are inferred from the claim text.