System and method for modulation of power and power related functions of PECVD discharge sources to achieve new film properties
AssigneeApplied Materials, Inc.
InventorMichael W. Stowell
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AssigneeApplied Materials, Inc.
InventorMichael W. Stowell
Estimating the term…
A method of generating a film during a chemical vapor deposition process is disclosed. One embodiment includes generating a first electrical pulse having a first pulse amplitude; using the first electrical pulse to generate a first density of radicalized species; disassociating a feedstock gas using the radicalized species in the first density of radicalized species, thereby creating a first deposition material; depositing the first deposition material on a substrate; generating a second electrical pulse having a second pulse amplitude, wherein the second pulse amplitude is different from the first pulse width; using the second electrical pulse to generate a second density of radicalized species; disassociating a feedstock gas using the radicalized species in the second density of radicalized species, thereby creating a second deposition material; and depositing the second plurality of deposition materials on the first deposition material.
A method of controlling a chemical vapor deposition process, the method comprising:
A method of generating a film during a chemical vapor deposition process, the method comprising:
A method of generating a film during a chemical vapor deposition process, the method comprising:
Dependencies are inferred from the claim text.