Mold for forming a molding member and method of fabricating a molding member using the same
AssigneeSeoul Semiconductor Co., Ltd.
InventorsJung Hwa Jung, Chung Hoon Lee
Life of this patent
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Abstract
There are provided a mold for forming a molding member and a method for forming a molding member using the same. The mold includes an upper surface, and a lower surface having an outer peripheral surface and a concave surface surrounded by the outer circumference. Injection and discharge holes extend from the upper surface to the lower surface. Accordingly, after the mold and the package are coupled so that the discharge hole is directed upward, a molding member can be formed on the package by injecting the molding material through the injection hole, whereby it is possible to prevent air bubbles from being captured in the molding member.
Claims18
A mold for forming a molding member on a package, comprising:
- an upper surface;
- a lower surface having an outer peripheral surface and a concave surface surrounded by the outer peripheral surface;
- and
- injection and discharge holes extending from the upper surface to the lower surface,
- wherein the mold is formed by insertion-molding a connection frame.
A method of forming a molding member, comprising:
- preparing a mold including an upper surface, a lower surface having an outer peripheral surface and a concave surface surrounded by the outer peripheral surface, and injection and discharge holes extending from the upper surface to the lower surface;
- preparing a package having an LED (Light Emitting Diode) mounted thereon;
- coupling the package and the mold so that the concave surface covers the LED, the outer peripheral surface is adjacent to an upper surface of the package, an edge portion of the package adjacent to the discharge hole is directed upward, and an other edge portion opposite to the edge portion of the package body is directed downward;
- and
- injecting a molding material into the injection hole,
- wherein the mold is formed by insertion-molding a connection frame.
Dependencies are inferred from the claim text.