Manufacturing method by treating substrate introduced into treatment apparatus from transfer container
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsShunpei Yamazaki, Noriyuki Matsuda
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AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsShunpei Yamazaki, Noriyuki Matsuda
Estimating the term…
The present invention provides a manufacturing method by which a substrate (typically, a TFT substrate) can be installed directly in a treatment apparatus by using a transfer container without shifting the substrate from the transfer container to another container. It is possible to use the container efficiently and transfer different substrates in size with one container. A manufacturing method in which a substrate is directly installed in an electrostatic-protected transfer container by a substrate supplier, and then the container is directly installed in a treatment apparatus by a substrate demander after transferring can be realized, thereby making it possible to transfer substrates such as a TFT substrate. A contamination of a substrate due to particles and electrostatic discharge damage of a TFT substrate can be avoided because a transferring operation is not needed. A manufacturing method in which a substrate holding portion of the container is replaced depending on the size of a substrate and different substrates in size can be transferred with one container may be employed.
A manufacturing method comprising:
A manufacturing method comprising:
Dependencies are inferred from the claim text.