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US 7,842,169 B2Granted
Method and apparatus for local polishing control
AssigneeApplied Materials, Inc.
InventorsStan Tsai, Feng Q. Liu, Yan Wang, Rashid Mavliev, Liang-Yuh Chen, Alain Duboust
Life of this patent
Estimating the term…
Abstract
A method and apparatus for local polishing and deposition control in a process cell is generally provided. In one embodiment, an apparatus for electrochemically processing a substrate is provided that selectively polishes discrete conductive portions of a substrate by controlling an electrical bias profile across a processing area, thereby controlling processing rates between two or more conductive portions of the substrate.
Claims32
An apparatus for electrochemically processing a substrate, comprising:
- a pad support;
- a removable polishing pad assembly disposed on the pad support, the pad assembly comprising:
- a first counter electrode embedded in an insulator;
- at least a second counter electrode embedded in the insulator and disposed laterally adjacent to the first counter electrode, the first and second counter electrodes having a concentric planar orientation;
- and
- a conductive polishing surface that is adapted to process the substrate, the polishing surface having a plurality of apertures exposing the first counter electrode and the second counter electrode, wherein the first and second counter electrodes are independently electrically biasable relative to the conductive surface.
3 more elements
An apparatus for electrochemically processing a substrate, comprising:
- a counter electrode assembly having a plurality of concentrically arranged counter electrodes embedded in an insulator and disposed on a pad support, at least one of the plurality of counter electrodes independently electrically biasable relative to a second one of the counter electrodes;
- a conductive polishing pad disposed on top of the plurality of counter electrodes, the conductive polishing pad having a first side adapted to polish the substrate and a second side facing the plurality of counter electrodes, where in the conductive polishing pad has a diameter substantially equal to that of the counter electrode assembly, the plurality of counter electrodes of the counter electrode assembly and the conductive pad forming a replaceable unitary replaceable assembly;
- a housing adapted to support the substrate therein;
- and
- an electrolyte delivery system adapted to provide an electrolyte adapted to provide a plurality of independently controlled electrical paths between the substrate and the plurality of counter electrodes through the conductive pad.
2 more elements
An apparatus for electrochemically processing a substrate, comprising:
- a pad support;
- a counter electrode assembly having a plurality of independently biasable concentric counter electrodes embedded in an insulator and disposed on the pad support;
- a polishing pad disposed on the counter electrode assembly opposite the pad support, the polishing pad having a diameter greater than a diameter of at least one of the counter electrodes, the polishing pad having a first side adapted to polish the substrate and a second side facing the at least one counter electrode;
- a plurality of conductive members on the first side of the polishing pad, wherein the at least one counter electrode, polishing pad and conductive members form a unitary replaceable assembly;
- and
- a plurality of independently controllable electrical paths laterally arranged and disposed between the conductive members and the counter electrodes.
3 more elements
An apparatus for electrochemically processing a substrate, comprising:
- a pad support;
- at least a first counter electrode embedded in an insulator and disposed on the pad support;
- a conductive polishing pad disposed on the first counter electrode and having a first side adapted to process the substrate and a second side facing the first counter electrode, the polishing pad having a plurality of apertures;
- and
- a plurality of independently biasable electrodes disposed between the counter electrode and the conductive polishing pad, the plurality of electrodes exposed to the first side of the polishing pad through the apertures, wherein the first counter electrode, the conductive polishing pad and the plurality of electrodes form a unitary replaceable assembly.
2 more elements
An apparatus for electrochemically processing a substrate comprising:
- a conductive polishing surface adapted to support the substrate in a position contacting a surface of the substrate with an electrolyte, the conductive polishing surface and substrate in contact therewith forming a first node;
- at least one counter electrode embedded in an insulator and disposed approximate the polishing surface;
- a plurality of concentrically arranged and independently biasable electrodes disposed between the polishing surface and the at least one counter electrode, the polishing surface, the counter electrode and the plurality of electrodes forming a unitary, replaceable pad assembly;
- and
- a plurality of independently biasable electric circuits formed across the electrolyte and having a common node defined at the first node, wherein each of the plurality of electrodes is adapted to independently adjust a first local rate of the electrochemical processing relative to a second local rate of electrochemical processing proximate an adjacent electrode of the plurality of electrodes.
2 more elements
Dependencies are inferred from the claim text.