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AssigneeHitachi Kokusai Electric Inc.
InventorsKatsuhisa Kasanami, Toshimitsu Miyata, Mitsunori Ishisaka
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A tubular electrode (215) and a tubular magnet (216) are installed on an external section of a processing furnace (202) for an MMT device. A susceptor (217) for holding a wafer (200) is installed inside a processing chamber (201) of the processing furnace. A gate valve (244) for conveying the wafer into and out of the processing chamber; and a shower head (236) for spraying processing gas in a shower onto the wafer, are installed inside the processing furnace. A high frequency electrode (2) and a heater (3) are installed inside the susceptor (217) with a clearance between them and the walls forming the space. The clearances formed between the walls forming the space in the susceptor and the high frequency electrode and the heater prevent damage to the high frequency electrode and the heater even if a thermal expansion differential occurs between the high frequency electrode, the heater and the susceptor.
A semiconductor producing device for supplying a processing gas to a vacuum container, exhausting the gas, and processing a substrate, wherein a substrate holding means for holding the substrate is installed inside the vacuum container, an electrode installation space is formed inside the substrate holding means for installing a high frequency electrode therein, the high frequency electrode is made from a material with a high melting point and anti-oxidizing properties and the high frequency electrode is installed with a clearance between itself and the walls forming the space, and the space is directly connected to the atmosphere through one of a plurality of holes in a solid shaft, and an electrode wire connected to the high frequency electrode connects to a terminal of the high frequency electrode after extending from the high frequency electrode to an outside section of the substrate holding means, and the electrode wire is at least partly inside the hole in the shaft.
A substrate holding means for holding a substrate, wherein an electrode installation space is formed inside the substrate holding means for installing a high frequency electrode therein, the high frequency electrode is made from a material with a high melting point and anti-oxidizing properties and the high frequency electrode is installed with a clearance between itself and the walls forming the space, and the space is directly connected to the atmosphere through one of a plurality of holes in a solid shaft, and an electrode wire connected to the high frequency electrode connects to a terminal of the high frequency electrode after extending from the high frequency electrode to an outside section of the substrate holding means, and the electrode wire is at least partly inside the hole in the shaft.
Dependencies are inferred from the claim text.