Method for bonding plastic micro chip

A method of manufacturing a plastic micro chip comprising an upper substrate, a lower substrate and a sample filling space having a predetermined height for filling a sample between the upper and lower substrates, the method comprising:

• (a) forming recesses in each of side lower ends of a bonding region of the upper substrate, wherein the bonding region is a circumference region of the sample filling space;
• and
• (b) overlapping the upper substrate and the lower substrate each other, and then introducing the organic solvent into the recesses to bond the upper and lower substrates,
• wherein the recesses are open channels and the organic solvent is introduced into the recesses by capillary phenomenon,
• wherein the bonding region is bonded by the organic solvent introduced into the recesses.

A method for making a plastic micro chip comprising:

• (a) providing an upper substrate and a lower substrate, the lower substrate and the upper substrate being adapted to be joined together along an interface in such a way as to define therebetween a sample filling space having a predetermined height, the sample filling space being entirely surrounded by solid plastic;
• further adapted to provide a fine channel within the solid plastic surrounding the sample filling space, the fine channel being provided in each of side lower ends of a bonding region of the upper substrate;
• further adapted to provide solvent delivery holes whereby solvent can be delivered to the fine channel;
• (b) bringing the upper substrate and lower substrate together into a laminating position;
• (c) introducing organic solvent into the fine channel to join the upper substrate with the lower substrate, with the organic solvent passing through the fine channel and effecting bonding by movement of the organic solvent by capillary action.