Socket with solder pad
AssigneeHon Hai Precision Ind. Co., Ltd.
InventorsFang-Chu Liao, Chun-Yi Chang
Life of this patent
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Abstract
A socket, for electrically connecting an IC package and a printed circuit board, comprises an insulative housing and a plurality of contacts received in the insulative housing. The insulative housing has an opening in a center thereof, a solder pad is received in the opening and has a soldering board which is soldered to the printed circuit board to enhance a mechanical connection between the socket and the printed circuit board.
Claims9
A socket, adapted for electrically connecting an IC package and a printed circuit board, comprising:
- an insulative housing defining an opening in a center thereof and a plurality of passageways surrounding the opening;
- a plurality of contacts received in the passageways;
- and
- at least one solder pad received in the opening of the insulative housing, the solder pad having a horizontal solder board for being soldering to the printed circuit board.
A socket, adapted for electrically connecting an IC package and a printed circuit board, comprising:
- an insulative housing defining a mating surface for supporting the IC package and a mounting surface opposed to the mating surface;
- a plurality of contacts received in the insulative housing;
- and
- at least one solder pad disposed in a field of the insulative housing without passageways, the solder pad having a horizontal solder board for being soldering to the printed circuit board, wherein
- the insulative housing defines an opening in a center thereof and surrounded by the passageways, the soldering pad is received in the opening.
An electrical connector comprising:
- an insulative housing defining a center vertical through opening surrounded by a plurality of vertically extending passageways;
- a plurality of contacts disposed in the corresponding passageways, respectively, each of said contacts being equipped with a solder section adapted to be surface mounting to an upper surface of a printed circuit board;
- and
- at least one discrete solder pad fastened to the housing in said center vertical through opening;
- wherein
- the solder pad includes a horizontal solder plate adapted to be surface mounting to the upper face of the printed circuit board under a condition that the solder plate is much larger than the solder section.
Dependencies are inferred from the claim text.