US 7,841,820 B2Granted

Universal modular wafer transport system

AssigneeCrossing Automation, Inc.

InventorsAnthony C. Bonora, Richard H. Gould, Roger G. Hine, Michael Krolak, Jerry A. Speasl

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Abstract

The present invention is a wafer transfer system that transports individual wafers between chambers within an isolated environment. In one embodiment, a wafer is transported by a wafer shuttle that travel within a transport enclosure. The interior of the transport enclosure is isolated from the atmospheric conditions of the surrounding wafer fabrication facility. Thus, an individual wafer may be transported throughout the wafer fabrication facility without having to maintain a clean room environment for the entire facility. The wafer shuttle may be propelled by various technologies, such as, but not limited to, magnetic levitation or air bearings. The wafer shuttle may also transport more than one wafer simultaneously. The interior of the transport enclosure may also be under vacuum, gas-filled, or subject to filtered air.

Claims17

Dependent claims

A wafer transport system for moving semiconductor wafers to and from wafer processing chambers, comprising:

a wafer carrier configured to travel along a path;
a first wafer transfer chamber interfaced with a first wafer processing chamber, the first wafer transfer chamber disposed in the path of the wafer carrier, the first wafer transfer chamber having a first wafer transfer mechanism defined to transfer the semiconductor wafer to and from the first wafer processing chamber that is not disposed in the path but is adjacent to the path;
a second wafer transfer chamber interfaced with a second wafer processing chamber, the second wafer transfer chamber disposed in the path of the wafer carrier, the second wafer transfer chamber having a second wafer transfer mechanism defined to enable a transfer of the semiconductor wafer to and from the second wafer processing chamber that is not disposed in the path but is adjacent to the path;
and
a wafer transfer enclosure disposed in the path to connect the first wafer transfer chamber with the second wafer transfer chamber, wherein each of the first wafer transfer chamber, the second wafer transfer chamber and the wafer transfer enclosure have path segments that couple together to define the path on which the wafer carrier moves in and along the wafer transfer enclosure, the first wafer transfer chamber and the second wafer transfer chamber;
wherein each of the first and second wafer transfer chambers and the wafer transfer enclosure is configured to support two wafer carriers in a vertically stacked orientation, so as to facilitate independent movement of each of the two wafer carriers through each of the first and second wafer transfer chambers and the wafer transfer enclosure in an in-line fashion.

3 more elements

A wafer transport system for moving semiconductor wafers to and from wafer processing chambers, comprising:

a first wafer transport tube, the first wafer transport tube defining a path along which a wafer carrier is configured to travel;
a first wafer transfer chamber coupled to the first wafer transport tube in an in-line configuration, the first wafer transfer chamber facilitating movement of the wafer carrier in-line with the path defined by the first wafer transport tube;
a first wafer processing chamber coupled to the first wafer transfer chamber;
wherein the first wafer transfer chamber includes a first wafer transfer mechanism for transferring a semiconductor wafer to and from the first wafer processing chamber;
wherein each of the first wafer transport tube and the first wafer transfer chamber is configured to support two wafer carriers in a vertically stacked orientation, so as to facilitate independent movement of each of the two wafer carriers through both the first wafer transport tube and the first wafer transfer chamber in an in-line fashion.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 11/938,236Filed 9 Nov 2007 · continuation
Priority: 31 Aug 2001
Published: US 2008/0101892 A11 May 2008
Granted: 30 Nov 2010
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

H10P 72/3411
The wafers being stored in a carrier, involving loading and unloading: involving loading and unloading of wafers
H10P 72/3204
Between different workstations: using magnetic elements
H10P 72/3402
The wafers being stored in a carrier, involving loading and unloading: mechanical parts of transfer devices
H10P 72/3408
The wafers being stored in a carrier, involving loading and unloading: docking arrangements

Family

Application60/316,722Us provisional application · filed 31 Aug 2001
Application10/234,640Parent of this continuation · filed 3 Sep 2002
US 2008/0101892 A1Pre-grant publication · published 1 May 2008
US 7,293,950 B2Parent of this continuation
US 2003/0129045 A1Published application
US 7,841,820 B2This patent

From the US filing history. Foreign family members aren’t listed.