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AssigneePanasonic Corporation
InventorsMasafumi Inoue, Fumio Kikutsugi, Masahiro Kihara
Estimating the term…
In electronic component mounting for a plurality of individual substrates held on a carrier, solder position deviation data is calculated for each individual substrate based on a mark position recognition result on a carrier after solder printing, a solder position recognition result, and electrode position information indicating the position of an electrode on each individual substrate, an operation of calculating position correction data, which is used to correct the positional deviation to mount electronic components at proper positions, is performed for each individual substrate based on the calculated solder position deviation data and the calculated position correction data is feed-forwarded to an electronic component mounting apparatus, and an electronic component mounting operation of a component mounting mechanism is controlled based on the mark position recognition result and the position correction data.
An electronic component mounting system that mounts electronic components on a plurality of individual substrates held in a carrier by soldering to thereby manufacture individual mounted boards, comprising:
An electronic component mounting method of mounting electronic components on a plurality of individual substrates held on a carrier such so as to be fixed by an adhesive resin coat provided on a surface of the carrier by soldering to thereby manufacture individual mounted boards, comprising:
Dependencies are inferred from the claim text.