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US 7,841,077 B2Granted
Method for manufacturing a wiring substrate
AssigneeSeiko Epson Corporation
InventorToshiki Hara
Life of this patent
Estimating the term…
Abstract
A wiring substrate comprises: a flexible substrate having a first region and a second region; a wiring line formed on the flexible substrate; and an electronic element that is disposed on the flexible substrate in the first region and electrically coupled to the wiring line. Flexibility of the first region is lower than flexibility of the second region.
Claims6
A method for manufacturing a wiring substrate, comprising:
- forming a wiring line on a flexible substrate having a first region and a second region;
- reducing flexibility of the first region of the flexible substrate;
- and
- fixing an electronic element to the first region,
- wherein the flexible substrate includes a resin to be hardened by applying predetermined energy, and the energy is supplied to the first region in the reducing of the flexibility of the first region.
2 more elements
A method for manufacturing a wiring substrate, comprising:
- reducing flexibility of a first region of a flexible substrate;
- forming a wiring line on the flexible substrate;
- and
- fixing an electronic element to the first region,
- wherein the flexible substrate includes a resin to be hardened by applying predetermined energy, and the energy is supplied to the first region in the reducing of the flexibility of the first region.
2 more elements
A method for manufacturing a wiring substrate, comprising:
- forming a wiring line on a flexible substrate;
- fixing an electronic element to a first region of the flexible substrate;
- and
- reducing flexibility of the first region,
- wherein the flexible substrate includes a resin to be hardened by applying predetermined energy, and the energy is supplied to the first region in the reducing of the flexibility of the first region.
2 more elements
Dependencies are inferred from the claim text.