Manufacturing method of wiring substrate and manufacturing method of semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorTomoharu Fujii
Life of this patent
Estimating the term…
Abstract
A multilayer wiring structural body 13 is formed on a surface 57A of a metal plate 57 used as a support plate in the case of forming the multilayer wiring structural body 13, and the metal plate 57 is patterned and a slot antenna 60 is formed.
Claims10
A method of manufacturing a plurality of semiconductor devices, each semiconductor device including a multilayer wiring structural body having a laminated wiring pattern and an insulating layer, an antenna disposed on one surface of said multilayer wiring structural body, and an electronic component disposed on another surface of said multilayer wiring structural body opposite to the one surface of the multilayer wiring structural body, the electronic component being electrically connected to the multilayer wiring structural body, the manufacturing method comprising:
- providing a first metal plate and a second metal plate;
- pasting the first metal plate to the second metal plate such that a surface opposite to a surface of the first metal plate on which the multilayer wiring structural body is to be formed is opposed to a surface opposite to a surface of the second metal plate on which the multilayer wiring structural body is to be formed;
- simultaneously forming the multilayer wiring structural bodies on the first and second metal plates such that the first and second metal plates support the respective multilayer wiring structural bodies while forming the respective multilayer wiring structural bodies;
- and
- patterning the first and second metal plates to form the antennas in the first and second metal plates.
A method of manufacturing a semiconductor device, the semiconductor device including a multilayer wiring structural body having a laminated wiring pattern and an insulating layer, an antenna disposed on one surface of said multilayer wiring structural body, and an electronic component disposed on another surface of said multilayer wiring structural body opposite to the one surface of the multilayer wiring structural body, the electronic component being electrically connected to the multilayer wiring structural body, the manufacturing method comprising:
- providing a metal plate;
- forming the multilayer wiring structural body on the metal plate such that the metal plate supports the multilayer wiring structural body while forming the multilayer wiring structural body, wherein the multilayer wiring structural body is formed with at least a first layer formed on the metal plate and then a second layer formed on the first layer and the metal plate;
- patterning the metal plate to form the antenna in the metal plate;
- forming a connection, part for the electronic component on the another surface of said multilayer wiring structural body;
- and
- mounting the electronic component on the connection part.
A method of manufacturing a semiconductor device, the semiconductor device including a multilayer wiring structural body having a laminated wiring pattern and an insulating layer, an antenna disposed on one surface of said multilayer wiring structural body, and an electronic component disposed on another surface of said multilayer wiring structural body opposite to the one surface of the multilayer wiring structural body, the electronic component being electrically connected to the multilayer wiring structural body, the manufacturing method comprising:
- providing a metal plate;
- forming the multilayer wiring structural body on the metal plate such that the metal plate supports the multilayer wiring structural body while forming the multilayer wiring structural body, wherein the multilayer wiring structural body is formed in a series of steps with a first layer being formed on the metal plate and a plurality of successive layers being formed on top of the first layer;
- patterning the metal plate to form the antenna in the metal plate;
- forming a connection part for the electronic component on the another surface of said multilayer wiring structural body;
- and
- mounting the electronic component on the connection part.
A method of manufacturing a semiconductor device, the semiconductor device including a multilayer wiring structural body having a laminated wiring pattern and an insulating layer, an antenna disposed on one surface of said multilayer wiring structural body, and an electronic component disposed on another surface of said multilayer wiring structural body opposite to the one surface of the multilayer wiring structural body, the electronic component being electrically connected to the multilayer structural body, the manufacturing method comprising:
- providing a metal plate;
- forming the multilayer wiring structural body on the metal plate such that the metal plate supports the multilayer wiring structural body while forming the multilayer wiring structural body, wherein forming the multiplayer wiring structural body further comprises:
- forming a first insulating layer on the metal plate;
- forming first openings in the insulating layer to the metal plate;
- and
- forming first wirings with conductive metal by electrolytic plating at least in the first openings;
- patterning the metal plate to form the antenna in the metal plate;
- forming a connection part for the electronic component on the another surface of said multilayer wiring structural body;
- and
- mounting the electronic component on the connection part.
Dependencies are inferred from the claim text.