Methods for integration of thin-film capacitors into the build-up layers of a PWB
AssigneeE. I. Du Pont de Nemours and Company
InventorsWilliam Borland, Daniel I. Amey, Jr., Karl H. Dietz, Cengiz Ahmet Palanduz, J. Stan Erickson
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Abstract
Provided herein are devices comprising a printed wiring board that comprise, singulated capacitors fabricated from known good, thin-film, fired-on-foil capacitors. Provided are methods of incorporating the singulated capacitors into the build-up layers of a printed wiring board to minimize impedance. The singulated capacitors have a pitch that allows each power and ground terminal of an IC to be directly connected to a power and ground electrode, respectively, of its own singulated capacitor. Using a feedstock of known good, fired-on-foil capacitors allows for improved PWB yield.
Claims14
A method of making a device comprising a printed wiring board, the method comprising:
- providing at least one foil structure having
- two sides and comprising
- a known good, thin-film, fired-on-foil capacitor comprising a dielectric layer and a second electrode layer having a footprint;
- applying metal to a side of the foil structure containing the second electrode;
- patterning a side of the foil structure not containing the second electrode to form a plurality of first electrodes;
- laminating the patterned side of the foil structure to a build-up layer of a printed wiring board (PWB);
- patterning the side of the foil structure containing the second electrode of the fired-on-foil capacitor to form a plurality of second electrodes within the footprint of the second electrode layer,
- wherein the forming of the plurality of the first electrodes and of the plurality of the second electrodes forms a plurality of singulated capacitors of a certain size and pitch such that each electrodes is available to be directly attached to a terminal of an integrated circuit;
- and
- wherein the plurality of singulated capacitors lies directly under and within an area of the integrated circuit.
A method of making a device comprising a printed wiring board, the method comprising:
- providing at least one foil structure having
- two sides and comprising
- a known good, thin-film, fired-on-foil capacitor comprising
- a dielectric layer and
- a second electrode layer having a footprint;
- applying metal to a side of the foil structure containing the second electrode;
- patterning a side of the foil structure not containing the second electrode to form a plurality of first electrodes;
- dicing the foil structure to form known good, diced components, the known good, diced components comprising at least one fired-on-foil capacitor;
- picking and placing onto a build-up layer of the printed wiring board (PWB) at least one diced component so that the patterned side of the foil structure contacts the build-up layer;
- laminating at least one known good, diced component to the build-up layer;
- patterning the side of the foil structure containing the second electrode of the fired-on foil capacitor to form a plurality of second electrodes within the footprint of the second electrode layer,
- wherein the forming of the plurality of the first electrodes and of the plurality of the second electrodes forms a plurality of singulated capacitors of a certain size and pitch such that each electrodes is available to be directly attached to a terminal of an integrated circuit;
- and
- wherein the plurality of singulated capacitors lies directly under and within an area of the integrated circuit.
Dependencies are inferred from the claim text.