Method of fabricating a transformer device
AssigneeIntel Corporation
InventorTelesphor Kamgaing
Life of this patent
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Abstract
A planar transformer or balun device, having small trace spacing and high mutual coupling coefficient, and a method of fabricating the same is disclosed. The method may comprise providing a first and a second inductor on a primary and a second substrate respectively, interleaving at least partially the first inductor with the second inductor, coupling the primary and the secondary substrates to form a unitary structure, and providing electrical contacts to couple the first and second inductors with another device or circuit.
Claims14
A method of fabricating a transformer device, comprising:
- providing a first inductor on a first substrate;
- providing a second inductor on a second substrate;
- interleaving at least partially the first inductor with the second inductor;
- coupling the first and the second substrates to form a unitary structure;
- and
- providing a plurality of electrical contacts on the unitary structure to separately connect to the first and the second inductors.
A method of fabricating a transformer device, comprising:
- interleaving a first inductor on a first substrate with a second inductor on a second substrate;
- providing an electrically non-conductive material on the first inductor and the second inductor;
- coupling the first and the second substrates to form a unitary structure;
- forming a plurality of vias through one of the first and the second substrates;
- providing an electrically conductive material in the vias;
- and
- providing a plurality of electrical contacts on the unitary structure to separately connect to the first and the second inductors.
A method of fabricating a transformer device, comprising:
- interleaving a first planar spiral inductor on a first substrate with a second planar spiral inductor on a second substrate;
- providing an electrically non-conductive material on the first planar spiral inductor and the second planar spiral inductor;
- coupling the first and the second substrates to form a unitary structure;
- forming a plurality of vias through one of the first and the second substrates;
- providing an electrically conductive material in the vias;
- removing a portion of the first substrate from the unitary structure;
- perforating a remaining portion of the first substrate;
- and
- providing the electrical contacts at the perforations to separately connect to the first and the second planar spiral inductors.
Dependencies are inferred from the claim text.