Method for manufacturing a thin closure magnetic head
AssigneeInternational Business Machines Corporation
InventorsRobert G. Biskeborn, Calvin S. Lo
Life of this patent
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Abstract
A method of manufacturing thin closure magnetic read/write heads, such as magnetic tape heads is provided. The method provides improved flexural strength of the closure so that the closure breakage during fabrication of the heads is mitigated and closure thickness is reduced. An array of chips is fabricated on a wafer. The array is closed, with a closure strip bonded to each row of the array. Closures span only the length of a row, so that the closures are not subjected to flexure during processing and breakage due to flexure is mitigated. Side bars are bonded to the array to form a column with dimensions similar to prior art columns. This allows columns manufactured by the invention to undergo additional processing using existing processes.
Claims12
A method for fabricating thin closure magnetic heads comprising:
- providing an array of chips;
- attaching closures to the array;
- lapping strips of closures to a predetermined thickness;
- attaching side bars to the array to form a column;
- and
- lapping a face of the side bars.
A method for manufacturing a column of magnetic tape heads comprising the following steps:
- providing an array of chip images;
- bonding a strip of closures to each row of chip images of the array;
- lapping the closures;
- bonding side bars to the array of chip images;
- and
- lapping ridges of the side bars to make the ridges collinear with the strips of closures.
Dependencies are inferred from the claim text.