Method of manufacturing an acoustic wave device

A method of manufacturing an acoustic wave device comprising:

• forming a first sealing portion on a substrate having an acoustic wave element thereon so that a functional res ion in which an acoustic wave oscillates of the acoustic wave element acts as a first non-covered portion;
• forming a second sealing portion on the first sealing portion so that the second sealing portion covers the first non-covered portion and a region on the first sealing portion in a cutting region for individuating acts as a second non-covered portion;
• forming a third sealing portion on the second sealing portion so as to cover the second non-covered portion;
• and
• cutting the substrate, the first sealing portion and the third sealing portion so that the second non-covered portion is divided;
• wherein:
• the step of forming the first sealing portion is a step of forming the first sealing portion so that a region where a penetrating electrode is to be formed acts as a third non-covered portion;
• the step of forming the second sealing portion is a step of forming the second sealing portion so that the region where the penetrating electrode is to be formed acts as the third non-covered portion;
• the step of forming the third sealing portion is a step of forming the third sealing portion so that the region where the penetrating electrode is to be formed acts as the third non-covered portion;
• and
• the method further includes forming the penetrating electrode in the third non-covered portion.