Adhesive for electronic component

A liquid adhesive for electronic components,

• which contains:
• a curable compound;
• a curing agent;
• and
• inorganic fine particles,
• a liquid portion in the liquid adhesive having a solubility parameter (SP value) in the range of 11 to 12, including 11 and not including 12,
• said inorganic fine particles including a mixture of at least inorganic fine particles (C) and inorganic fine particles (D),
• the inorganic fine particles (C) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) in the range of 20 to 30, including 20 and 30, and
• the inorganic fine particles (D) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) of 65 or more,
• wherein a blending amount of the inorganic fine particles (D) is 30 to 600 parts by weight to 100 parts by weight of the inorganic fine particles (C), and
• wherein a total content of the inorganic fine particles (C) and the inorganic fine particles (D) is 2 to 20 parts by weight to 100 parts by weight of the curable compound.

A liquid adhesive for electronic components,

• which contains:
• a curable compound;
• a curing agent;
• and
• inorganic fine particles,
• a liquid portion in the liquid adhesive having a solubility parameter (SP value) in the range of 12 to 14, including 12 and 14,
• said inorganic fine particles including a mixture of at least inorganic fine particles (E) and inorganic fine particles (F),
• the inorganic fine particles (E) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) of 30 or less, and
• the inorganic fine particles (F) having an average primary particle diameter of 50 nm or less and a hydrophobization degree (M value) of 64 or more,
• wherein a blending amount of the inorganic fine particles (F) is 30 to 600 parts by weight to 100 parts by weight of the inorganic fine particles (E), and
• wherein a total content of the inorganic fine particles (E) and the inorganic fine particles (F) is 2 to 20 parts by weight to 100 parts by weight of the curable compound.