Semiconductor device and an information management system therefor
AssigneeOki Semiconductor Co., Ltd.
InventorIsao Kudo
Life of this patent
Estimating the term…
Abstract
Individual two-dimensional barcodes are provided for individual chips arrayed on a wafer, individual lead frames to each of which chips are bonded and individual packaged products constituted of resin sealed semiconductor chips based upon chip ID information, to enable information management to be implemented separately for individual chips, individual frames and individual chip products. Thus, a higher degree of efficiency and a higher degree of accuracy in the information management for semiconductor devices are achieved in all processes of semiconductor production including the individual manufacturing processes, the physical distribution process, the shipping process and the claim handling process.
Claims18
A semiconductor device comprising:
- a semiconductor chip having connecting electrodes;
- a plurality of outer terminals, each of which electrically connected to corresponding ones of the electrodes;
- and
- a package fixing the semiconductor chip and the outer terminals, the package having a top surface on which a two-dimensional code pattern and another pattern are marked directly, the another pattern positioned nearer to a center of the top surface than the two-dimensional code pattern.
A semiconductor device comprising:
- a semiconductor chip having connecting electrodes;
- a plurality of outer terminals, each of which electrically connected to corresponding ones of the electrodes;
- and
- a package fixing the semiconductor chip and the outer terminals, the package having a top surface on which a two-dimensional code pattern and another pattern are marked directly, the two-dimensional code pattern positioned farther from a center of the top surface than the another pattern.
Dependencies are inferred from the claim text.