Transfer molding method and system for electronic devices

Method of molding an electronic device, comprising the steps of:

• providing a mold supply pot;
• providing molding compound in the mold supply pot;
• locating the electronic device next to a molding cavity and clamping the electronic device to the molding cavity;
• positioning a movable mold surface comprised in the molding cavity to form a first gap between the movable mold surface and the electronic device;
• discharging the molding compound from the mold supply pot into a runner and distributing the molding compound through the runner into the molding cavity until the molding cavity is completely filled;
• after filling the molding cavity with said molding compound, driving the movable mold surface to form a second gap between the movable mold surface and the electronic device which is smaller than the first gap, whereby to compress the molding compound in the molding cavity and to produce a molded electronic device;
• and
• separating the molded electronic device from the molding cavity,
• wherein the movable mold surface is maintained at the position where it forms the first gap with the electronic device throughout the discharging step.