Minute shape molding method and apparatus thereof
AssigneeToshiba Kikai Kabushiki Kaisha
InventorsAtsushi Takemoto, Jun Koike
Life of this patent
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Abstract
A method of molding a minute shape, in which at least one of a pair of dies is provided with an uneven section of a minute shape on a molding surface thereof, clamping of the pair of dies is stopped immediately before the dies are completely clamped, a resin is injected into a cavity, and thereafter the dies are completely clamped to thereby transcribe the shape of the uneven section onto the resin includes preparing a plurality of transcription dies each provided with the uneven section on a molding surface thereof, heating one of the transcription dies which is not used to mold a product by a heating unit, and exchanging the transcription dies with each other, at a point in time at which molding is completed, to thereby mold the product continuously.
Claims4
A method of molding a minute shape, in which at least one of a pair of dies arranged to be opposed to each other is a transcription die provided with an uneven section of a minute shape for molding a product on a molding surface thereof, and the other die is a fixed die arranged opposed to the transcription die, comprising:
- preparing a first transcription die and a second transcription die that are each detachably fixable to a movable side mounting platen provided with a cooling base, and one fixed die that is fixed to a fixed side mounting platen;
- partially clamping the first transcription die to the fixed die;
- injecting a resin into a cavity formed by the first transcription die and the fixed die;
- thereafter,
- completing clamping of the first transcription die and the fixed die;
- heating the second transcription die with a heating unit, while a product is molded by using the first transcription die and the and the fixed die;
- transferring, after the product is molded, the first transcription die to a heating unit;
- transferring, at the same time, the second transcription heated by the heating unit to the clamping mechanism;
- and
- molding a product by using the second transcription die and the fixed die by partially clamping the second transcription die to the fixed die, injecting a resin into a cavity formed by the second transcription die and the fixed die and thereafter, completing clamping of the second transcription die and the fixed die.
A minute shape molding equipment, in which at least one of a pair of dies arranged to be opposed to each other is a die transcription provided with an uneven section of a minute shape for molding a product on a molding surface thereof, and the other die is a fixed die arranged opposed to the transcription die, clamping of the pair of dies is stopped immediately before the dies are completely clamped by a clamping mechanism, a resin is injected into a cavity formed by the pair of dies, and thereafter the dies are completely clamped to thereby transcribe the shape of the uneven section onto the resin, comprising:
- a clamping mechanism configured to clamp the pair of dies, the clamping mechanism having a movable side mounting platen and a fixed side mounting platen;
- a cooling base provided on the movable side mounting platen;
- an injection mechanism configured to inject a resin into a cavity of the pair of dies;
- a first transcription die and a second transcription die that are each detachably fixable to the movable side mounting platen;
- one fixed die that is fixed to the fixed side mounting platen;
- at least one heating unit configured to heat a transcription die;
- and
- a transfer mechanism configured to transfer the first transcription die from the movable side mounting platen to the at least one heating unit after a product has been molded using the first transcription die and the fixed die, and configured to transfer the second transcription die heated to a predetermined temperature condition by the at least one heating unit to the movable side mounting platen of the clamping mechanism.
Dependencies are inferred from the claim text.