Transmission/reception semiconductor device with memory element and antenna on same side of conductive adhesive

A semiconductor device comprising:

• a first element forming layer;
• a second element forming layer;
• and
• an adhesive layer which adheres the first element forming layer and the second element forming layer and contains a conductive particle,
• wherein the first element forming layer includes a first transistor and a second transistor provided over an insulating layer, a first conductive layer which functions as a source wiring or a drain wiring of the first transistor, and a second conductive layer which functions as a source wiring or a drain wiring of the second transistor;
• wherein the second element forming layer includes a memory element comprising a third conductive layer, an organic compound layer or a phase change layer, and a fourth conductive layer laminated in this order, a fifth conductive layer which functions as an antenna, a third transistor which overlaps the memory element, a sixth conductive layer which functions as one of a source wiring or drain wiring of the third transistor, and a seventh conductive layer which functions as the other of the source wiring or drain wiring of the third transistor;
• wherein the seventh conductive layer is electrically connected to the fourth conductive layer;
• wherein the fifth conductive layer which functions as the antenna and the first conductive layer which functions as the source wiring or the drain wiring of the first transistor are electrically connected through the conductive particle, and
• wherein the second conductive layer which functions as the source wiring or the drain wiring of the second transistor and the sixth conductive layer which functions as one of the source wiring or drain wiring of the third transistor are electrically connected through the conductive particle.

A semiconductor device comprising:

• a first element forming layer;
• a second element forming layer;
• and
• a conductive layer by which the first element forming layer and the second element forming layer are adhered and which includes an adhesive layer containing a conductive particle,
• wherein the first element forming layer includes:
• a first transistor and a second transistor provided over an insulating layer;
• an interlayer insulating layer which covers the first transistor and the second transistor;
• and
• a first conductive layer which functions as a source wiring or a drain wiring of the first transistor and is connected to a source region or a drain region of the first transistor through a first opening portion provided in the interlayer insulating layer and is exposed on a back surface of the first element forming layer through a second opening portion provided in the insulating layer and the interlayer insulating layer;
• a second conductive layer which functions as a source wiring or a drain wiring of the second transistor and is connected to a source region or a drain region of the second transistor through a third opening portion provided in the interlayer insulating layer and is exposed on the back surface of the first element forming layer through a fourth opening portion provided in the insulating layer and the interlayer insulating layer;
• wherein the second element forming layer includes a third conductive layer which functions as an antenna and a memory element comprising a fourth conductive layer, an organic compound layer or a phase change layer, and a fifth conductive layer laminated in this order;
• wherein the fourth conductive layer of the memory element and the exposed portion of the first conductive layer which functions as the source wiring or the drain wiring of the first transistor are electrically connected through at least one of the conductive particles of the adhesive layer;
• and
• wherein the third conductive layer which functions as the antenna and the exposed portion of the second conductive layer which functions as the source wiring or the drain wiring of the second transistor are electrically connected through at least one of the conductive particles of the adhesive layer.