Method of polishing tape-shaped substrate and substrate for oxide superconductor
AssigneeNihon Micro Coating Co., Ltd.
InventorsYuji Horie, Noriyuki Kumasaka, Sanaki Horimoto
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Abstract
A target surface of a tape-shaped substrate of an oxide superconductor with an intermediate layer formed on this target surface and an oxide superconductor thin film is polished by causing the tape-shaped substrate to continuously run. The polishing step includes an initial polishing process for carrying out random polishing of the target surface and a finishing process that is carried out after the initial polishing process for forming grooves on the target surface along the running direction of the substrate. The intermediate layer has an in-plane directionality of 7° or less. The tape-shaped substrate is fabricated by rolling nickel, a nickel alloys or stainless steel.
Claims10
A method of polishing a target surface of a tape-shaped substrate of an oxide superconductor, said superconductor comprising an intermediate layer formed on said target surface of said tape-shaped substrate and an oxide superconductor thin film, said method comprising a polishing step of polishing said target surface while causing said tape-shaped substrate to continuously run in a running direction, said polishing step including an initial polishing process for carrying out random polishing of said target surface and a finishing process that is carried out after said initial polishing process for forming grooves on said target surface along said running direction.
Dependencies are inferred from the claim text.