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AssigneeThomson Licensing
InventorsJulian Thevenard, Dominique Lo Hine Tong, Ali Louzir, Corinne Nicolas, Christian Person, Jean-Philippe Coupez
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The present invention relates to an interconnection system of a first substrate (1) comprising at least one first transmission line (3) with a second substrate (10) comprising at least one second transmission line (11), the orientation of the first substrate with respect to the second substrate being arbitrary. The first substrate (1) comprises at least one metallized hole at one extremity of said first line and the second substrate (10) comprises a projecting element extending said second line and a ground saving, said projecting element being inserted into the metallized hole. The invention notably applies in the domain of microwaves and can interconnect a substrate comprising a printed antenna with a substrate receiving the processing circuits of the signal.
An interconnection system of a first substrate comprising at least one first transmission line with a second substrate comprising at least one second transmission line, the orientation of the first substrate with respect to the second substrate being arbitrary, the first substrate comprising at least a metalized hole at an extremity of said at least one first transmission line and the hole is surrounded, on the two faces of the first substrate, by a non-metalized saving the second substrate comprising a projecting element extending from said at least one second transmission line and a ground saving, said projecting element being inserted into the metalized hole, wherein the saving formed between the metallized hole and a ground plane of the first substrate, associated with the at least one first transmission line crossing the saving together with the at least one second transmission line located on the second substrate and its opposite ground saving forms a low-pass filtering element with a zero transmission.
Dependencies are inferred from the claim text.