US 7,804,693 B2 · Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same

Abstract

There are provided a printed circuit board having a structure for relieving a stress concentration on an outer most lead of leads, due to a difference in thermal expansion coefficients between the semiconductor device and the printed circuit board when the semiconductor device is mounted on the printed circuit board. The printed circuit board includes an inner lead portion to be connected to the semiconductor device. The inner lead portion includes a plurality of leads, arranged in parallel with a same pitch in a predetermined area, and additional leads located near both ends of the predetermined area in which the plurality of leads are arranged in parallel, respectively, wherein each of the plurality of leads has a pitch smaller than 30 μm and a width of the additional lead is wider than 20 μm. There are also provided a semiconductor chip package equipped with the printed circuit board according to the present invention.

Claims8

Dependent claims

A printed circuit board, which includes an inner lead portion to be connected to a semiconductor device, the inner lead portion comprising:

a plurality of parallel leads with substantially the same pitch between each of the plurality of leads;
a first linear dummy lead parallel with and spaced apart from an outermost lead of the plurality of leads, the first linear dummy lead having a first length and a first width greater than or equal to about 0.67 times the pitch between the plurality of leads;
and
a second linear dummy lead parallel with and adjacent to the first linear dummy lead, the second linear dummy lead having a second width and a second length, a gap between the first and second linear dummy leads being greater than the pitch between the plurality of leads.

1 more element

Dependencies are inferred from the claim text.

Facts

Application

11/167,858Filed 27 Jun 2005

Priority

KR 10-2004-005714122 Jul 2004

Published

US 2006/0016619 A126 Jan 2006

Granted

28 Sep 2010

Term ends

Not estimatedThe source records don’t support an estimate.

Classification10 codes

H10W 70/65
Characterised by their interconnections: shapes or dispositions of interconnections
H05K 1/111
Printed elements for providing electric connections to or between printed circuits: pads for surface mounting, e.g. lay-out
H05K 1/0271
Details: arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal…
H05K 1/189
Structurally associated with non-printed electric components: characterised by the use of flexible or folded printed circuits

Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same

Life of this patent

Printed circuit board having structure for relieving stress concentration, and semiconductor chip package equipped with the same

Life of this patent

Abstract

Claims8