Wafer inspecting method
AssigneeSamsung Electronics Co., Ltd.
InventorsJi-Hye Kim, Yu-Sin Yang, Jong-An Kim, Moon-Shik Kang, Ji-Young Shin
Life of this patent
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Abstract
A wafer inspecting method including the steps of: multi-scanning a pattern image of a unit inspection region in a normal state and a pattern image of a unit inspection region to be inspected, respectively, using different inspection conditions; comparing the multi-scanned pattern images in the normal state with the multi-scanned pattern images to be inspected obtained by the same inspection conditions, and storing differences between the pattern images as difference images; generating a discrimination difference image by calculating a balance between the stored difference images; and discriminating a defect from noise by using the discrimination difference image.
Claims12
A wafer inspecting method comprising:
- scanning a pattern image of a unit inspection region of a first wafer in a normal state in a first mode with definite inspection conditions, and setting the scanned pattern image as a first reference image;
- scanning a pattern image of a unit inspection region of a second wafer to be inspected in the first mode, and storing the scanned pattern image as a first detection image;
- comparing the first reference image and the first detection image, and storing a difference of the images as a first difference image;
- scanning a pattern image of the unit inspection region of the first wafer in the normal state in a second mode with inspection conditions different from the first mode, and setting the scanned pattern image as a second reference image;
- scanning a pattern image of the unit inspection region of the second wafer to be inspected in the second mode, and storing the scanned pattern image as a second detection image;
- comparing the second reference image and the second detection image, and storing a difference of the images as a second difference image;
- generating a third difference image by calculating a balance between the first difference image and the second difference image;
- and
- discriminating a defect from noise by using the third difference image.
Dependencies are inferred from the claim text.