Semiconductor component with surface mountable devices and method for producing the same
AssigneeInfineon Technologies AG
InventorsErich Syri, Gerold Gruendler, Juergen Hoegerl, Thomas Killer, Volker Strutz
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Abstract
A semiconductor component including: a substrate, at least one semiconductor chip arranged on the substrate and at least one passive device likewise arranged on the substrate. The passive device is mounted with its underside on the substrate. The semiconductor component further includes an interspace disposed between the underside of the passive device and the substrate. The interspace is filled with an underfilling material. In order to avoid the solder pumping effect, the upper side and the lateral sides of the passive device are also embedded in a plastic compound.
Claims12
A semiconductor component including:
- a substrate;
- at least one semiconductor chip arranged directly on the substrate and including an upper side, an underside, and lateral sides;
- a first underfilling material disposed within an interspace between the underside of the semiconductor chip and the substrate without embedding the upper side and lateral sides of the semiconductor chip;
- at least one passive device arranged directly on the substrate and including an upper side, an underside, and lateral sides, wherein the passive device is arranged adjacent to and spaced apart from the semiconductor chip such that no portion of the passive device lies between the semiconductor chip and the substrate;
- and
- a second underfilling material disposed within an interspace between the underside of the passive device and the substrate and embedding the upper side and the lateral sides of the passive device, wherein the second underfilling material embeds only the passive device and not the semiconductor chip.
Dependencies are inferred from the claim text.