Techniques for packaging a multiple device component
AssigneeMicron Technology, Inc.
InventorsTodd O. Bolken, Chad A. Cobbley
Life of this patent
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Abstract
A technique for packaging multiple devices to form a multi-chip module. Specifically, a multi-chip package is coupled to an interposer to form the multi-chip module. The multi-chip package includes a plurality of integrated circuit chips coupled to a carrier. The chips are encapsulated such that conductive elements are exposed through the encapsulant. The conductive elements are electrically coupled to the chips. The interposer is configured such that vias are aligned with the conductive elements. Conductive material may be disposed into the vias to provide signal paths from the integrated circuit chips to conductive balls disposed on the backside of the interposer.
Claims14
A module comprising:
- a multi-chip package comprising:
- a carrier;
- a first integrated circuit die coupled to the carrier;
- a second integrated circuit die coupled to the carrier;
- an encapsulant disposed about each of the first integrated circuit die and the second integrated circuit die;
- and
- a plurality of conductive elements coupled between an outer surface of the encapsulant and one of the first integrated circuit die and the second integrated circuit die;
- and
- an interposer separate from the multi-chip package comprising a plurality of vias therethrough and having a first side and a second side, wherein the first side of the interposer is configured to be coupled to the multi-chip package such that each of the plurality of vias is aligned with a respective one of the plurality of conductive elements, wherein the interposer comprises a plurality of redistribution layers arranged to form signal paths traverse to the vias.
Dependencies are inferred from the claim text.