Ball grid array structures having tape-based circuitry
AssigneeMicron Technology, Inc.
InventorMichael W. Morrison
Life of this patent
Estimating the term…
Abstract
Semiconductor device packages formed in accordance with methods of packaging semiconductor dice in grid array-type semiconductor device packages using conventional lead frame or lead lock tape assembly equipment are disclosed. Circuitry-bearing structure having an electrically insulating layer that carries redistribution electrical connections having redistributed bond pads and conductive traces and which is supported from beneath by a support layer are configured for securing to the active surface of a semiconductor die. The support layer may comprise an electrically conductive material, which may act as a heat sink or as a ground plane for the packaged semiconductor device. A semiconductor device and a semiconductor assembly are also provided.
Claims25
A circuitry-bearing structure for use in forming a semiconductor device assembly including redistributed electrical connections, comprising:
- a tape comprising an electrically insulating material having a top surface and carrying a portion of the redistributed electrical connections, the portion of the redistributed electrical connections comprising redistributed bond pads and conductive traces on the top surface of the insulating material;
- and
- an at least semi-rigid support layer secured adjacent to a surface of the tape opposite from the redistributed electrical connections.
A circuitry-bearing structure for use in forming a semiconductor device assembly including redistributed electrical connections, comprising:
- a tape comprising an electrically insulating material having a top surface and a portion of the redistributed electrical connections carried by the electrically insulating material, the portion of the redistributed electrical connections comprising redistributed bond pads and conductive traces on the top surface of the insulating material;
- and
- an at least semi-rigid support layer secured adjacent to a surface of the tape opposite from the redistributed electrical connections.
A semiconductor device, comprising:
- a semiconductor die having an active surface including a central region having bond pads thereupon;
- a first segment comprising support structure and having a top surface with a first circuit portion located directly thereon and another, opposing surface secured over a portion of the active surface adjacent the central region;
- a second segment discrete from the first segment comprising a support structure and having a top surface with a second circuit portion located directly thereon and another, opposing surface secured over another portion of the active surface adjacent the central region opposite the first segment;
- and
- intermediate conductive elements electrically connecting bond pads in the central region of the active surface to corresponding conductive traces on respective top surfaces of the first and second segments.
A semiconductor device assembly including redistributed electrical connections, comprising:
- a semiconductor die having an active surface including a central region having bond pads thereon;
- a first adhesive layer positioned on a portion of the active surface of the semiconductor die adjacent the central region;
- a first segment having a top surface secured to the first adhesive layer and comprising a portion of the redistributed electrical connections comprising redistributed bond pads and conductive traces located directly on the top surface;
- and
- intermediate conductive elements electrically connecting bond pads to corresponding conductive traces on the first segment.
Dependencies are inferred from the claim text.