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US 7,804,167 B2Granted
Wire bond integrated circuit package for high speed I/O
AssigneeLSI Logic Corporation
InventorsClifford Fishley, Abiola Awujoola, Leonard Mora, Amar Amin, Maurice Othieno, Chok J. Chia
Life of this patent
Estimating the term…
Abstract
An integrated circuit package includes a package substrate, a die attach pad formed on the package substrate for securing a die to the package substrate, a ground bonding ring formed on the package substrate for attaching core and I/O ground bond wires between the die and the package substrate, and a first plurality of bond fingers formed immediately adjacent to the ground bonding ring for attaching a first set of I/O signal bond wires between the package substrate and the die.
Claims17
An integrated circuit package comprising:
- a package substrate;
- a die attach pad formed on the package substrate for securing a die to the package substrate;
- a ground bonding ring formed on the package substrate for attaching core and I/O ground bond wires between the die and the package substrate;
- a first plurality of bond fingers formed immediately adjacent to an inside of the ground bonding ring for attaching a set of transmit I/O signal bond wires between the package substrate and the die;
- a power bonding ring formed immediately adjacent to an outside of the ground bonding ring for attaching I/O and core power bond wires between the die and the package substrate, wherein the ground bonding ring is disposed between the power bonding ring and the first plurality of bond fingers;
- a second plurality of bond fingers formed immediately adjacent to an outside of the power bonding ring for attaching a set of receive I/O signal bond wires between the package substrate and the die, wherein the power bonding ring is disposed between the second plurality of bond fingers and the ground bonding ring;
- and
- a third plurality of bond fingers formed immediately outside the second plurality of bond fingers for attaching another set of I/O signal bond wires between the package substrate and the die, wherein the second plurality of bond fingers is disposed between the third plurality of bond fingers and the power bonding ring;
- wherein the power bonding ring is electrically connectable to a first voltage source;
- wherein the ground bonding ring is electrically connectable to a second voltage source which is separate from the first voltage source;
- wherein the set of transmit I/O signal bond wires are of shorter length than the set of receive I/O signal bond wires.
8 more elements
A method of making an integrated circuit package comprising steps of:
- providing a package substrate;
- forming a die attach pad on the package substrate for securing an integrated circuit die to the package substrate;
- forming a ground bonding ring on the package substrate for attaching core and I/O ground bond wires between the die and the package substrate;
- and
- forming a first plurality of bond fingers immediately adjacent to an inside of the ground bonding ring for attaching a set of transmit I/O signal bond wires between the package substrate and the die;
- forming a power bonding ring immediately adjacent to an outside of the mind bonding ring for attaching core and I/O power bond wires between the die and the package substrate, wherein the ground bonding ring is disposed between the power bonding ring and the first plurality of bond fingers;
- forming a second plurality of bond fingers immediately adjacent to an outside of the power bonding it for attaching a set of receive I/O signal bond wires between the package substrate and the die, wherein the power bonding ring is disposed between the second plurality of bond fingers and the ground bonding ring;
- and
- forming a third plurality of, bond fingers immediately outside the second plurality of bond fingers for attaching another set of I/O signal bond wires between the package substrate and the die, wherein the second plurality of bond fingers is disposed between the third plurality of bond fingers and the power bonding ring;
- wherein the power bonding ring is electrically connectable to a first voltage source;
- wherein the ground bonding ring is electrically connectable to a second voltage source which is separate from the first voltage source;
- wherein the set of transmit I/O signal bond wires are of shorter length than the set of receive I/O signal bond wires.
9 more elements
Dependencies are inferred from the claim text.