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US 7,804,166 B2Granted
Integrated circuit package system with stacking module
AssigneeSTATS ChipPAC, Ltd.
InventorsJoungin Yang, YoungSik Cho, Nam Ju Cho
Life of this patent
Estimating the term…
Abstract
An integrated circuit package system includes: providing a module substrate having dimension predetermined for attachment adjacent a device; attaching a module die adjacent the module substrate; and applying a module molding material cantilevered from the module substrate and over the module die.
Claims20
A method for manufacturing an integrated circuit package system comprising:
- providing a module substrate having a module substrate internal surface and dimensions predetermined for attachment adjacent a device;
- attaching a module die having a module die connect surface and adjacent the module substrate;
- and
- applying a module molding material cantilevered from the module substrate and over the module die, the module molding material directly on substantially all of the module substrate internal surface and the module die connect surface.
1 more element
A method for manufacturing an integrated circuit package system comprising:
- forming a module substrate having a module substrate conductor, a module substrate edge, a module substrate internal surface, and dimensions predetermined for attachment adjacent a device;
- forming a module die attach material adjacent the module substrate;
- mounting a module die having a module die connect surface and a module die edge adjacent the module substrate edge and over the module die attach material;
- and
- forming a module molding material cantilevered from the module substrate and over the module die wherein the module substrate conductor and the module die attach material are partially exposed, the module molding material directly on substantially all of the module substrate internal surface and the module die connect surface.
2 more elements
An integrated circuit package system comprising:
- a module substrate having a module substrate internal surface and dimensions predetermined for attachment adjacent a device;
- a module die having a module die connect surface and adjacent the module substrate;
- and
- a module molding material cantilevered from the module substrate and over the module die, the module molding material directly on substantially all of the module substrate internal surface and the module die connect surface.
1 more element
Dependencies are inferred from the claim text.